ISBN: 9781441909831
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Plus…
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2009, ISBN: 9781441909831
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Hardcover, Auflage: 2010, 301 Seiten, Publiziert: 2009-11-17T00:00:01Z, Produktgruppe: Book, 1.33 kg, Books Gl… Plus…
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2010, ISBN: 9781441909831
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2009, ISBN: 9781441909831
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2009, ISBN: 1441909834
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ISBN: 9781441909831
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Plus…
2009, ISBN: 9781441909831
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Hardcover, Auflage: 2010, 301 Seiten, Publiziert: 2009-11-17T00:00:01Z, Produktgruppe: Book, 1.33 kg, Books Gl… Plus…
2010
ISBN: 9781441909831
*RF and Microwave Microelectronics Packaging* - 2010 edition / gebundene Ausgabe für 160.49 € / Aus dem Bereich: Bücher, Wissenschaft, Technik Medien > Bücher nein Buch (gebunden) Hardcov… Plus…
2009, ISBN: 9781441909831
[PU: Springer US], Gepflegter, sauberer Zustand. 5460110/2, DE, [SC: 0.00], gebraucht; sehr gut, gewerbliches Angebot, 2010, Banküberweisung, Kreditkarte, PayPal, Expédition internationale
2009, ISBN: 1441909834
[EAN: 9781441909831], New book, [PU: Springer], Clean and crisp and new!, Books
Données bibliographiques du meilleur livre correspondant
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Informations détaillées sur le livre - RF and Microwave Microelectronics Packaging
EAN (ISBN-13): 9781441909831
ISBN (ISBN-10): 1441909834
Version reliée
Livre de poche
Date de parution: 2009
Editeur: Springer Nature Singapore
285 Pages
Poids: 0,635 kg
Langue: eng/Englisch
Livre dans la base de données depuis 2007-08-09T02:08:01+02:00 (Paris)
Page de détail modifiée en dernier sur 2024-04-19T02:28:54+02:00 (Paris)
ISBN/EAN: 1441909834
ISBN - Autres types d'écriture:
1-4419-0983-4, 978-1-4419-0983-1
Autres types d'écriture et termes associés:
Auteur du livre: cahill, franklin, kim, kuang
Titre du livre: self packaging, microwave for one, microelectronics
Données de l'éditeur
Auteur: Ken Kuang; Franklin Kim; Sean S. Cahill
Titre: RF and Microwave Microelectronics Packaging
Editeur: Springer; Springer US
285 Pages
Date de parution: 2009-11-17
New York; NY; US
Imprimé / Fabriqué en
Langue: Anglais
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
POD
XVI, 285 p.
BB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; 3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; high-frequency electronics; material; packaging and processing methods; simulation; thermal management; thermal mechanical designs; Electronics and Microelectronics, Instrumentation; Microwaves, RF Engineering and Optical Communications; Electronic Circuits and Systems; Schaltkreise und Komponenten (Bauteile); EA; BC
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras
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