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RF and Microwave Microelectronics Packaging
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RF and Microwave Microelectronics Packaging - Livres de poche

2010, ISBN: 1441909850, Lieferbar binnen 4-6 Wochen Frais d'envoiVersandkostenfrei innerhalb der BRD

ID: 9781441909855

Internationaler Buchtitel. In englischer Sprache. Verlag: SPRINGER VERLAG GMBH, 304 Seiten, L=156mm, B=234mm, H=16mm, Gew.=426gr, [GR: 26850 - TB/Elektronik/Elektrotechnik/Nachrichtentechnik], [SW: - Technology & Industrial Arts], Kartoniert/Broschiert, Klappentext: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

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Détails sur le livre

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Informations détaillées sur le livre - RF and Microwave Microelectronics Packaging


EAN (ISBN-13): 9781441909855
ISBN (ISBN-10): 1441909850
Livre de poche
Date de parution: 2010
Editeur: SPRINGER VERLAG GMBH
304 Pages
Poids: 0,426 kg
Langue: eng/Englisch

Livre dans la base de données depuis 17.05.2012 15:26:51
Livre trouvé récemment le 17.05.2012 15:26:51
ISBN/EAN: 9781441909855

ISBN - Autres types d'écriture:
1-4419-0985-0, 978-1-4419-0985-5


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