Frederic P. Miller:Dual in-line package
- Livres de poche ISBN: 6130233728
[EAN: 9786130233723], Neubuch, [PU: Alphascript Publishing], This item is printed on demand - it takes 3-4 days longer - Neuware -In microelectronics, a dual in-line package, sometimes ca… Plus…
[EAN: 9786130233723], Neubuch, [PU: Alphascript Publishing], This item is printed on demand - it takes 3-4 days longer - Neuware -In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase 'DIP package' is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. 100 pp. Englisch, Books<
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Miller, Frederic P.:Dual in-line package / Frederic P. Miller (u. a.) / Taschenbuch / Englisch / Alphascript Publishing / EAN 9786130233723
- Livres de poche ISBN: 9786130233723
[ED: Taschenbuch], [PU: Alphascript Publishing], In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing an… Plus…
[ED: Taschenbuch], [PU: Alphascript Publishing], In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase "DIP package" is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is..., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 100, Banküberweisung, PayPal, Klarna-Sofortüberweisung, [CT: Sonstiges / Sonstiges]<
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Miller, Frederic P.:Dual in-line package | Frederic P. Miller (u. a.) | Taschenbuch | Englisch | Alphascript Publishing | EAN 9786130233723
- Livres de poche ISBN: 9786130233723
[ED: Taschenbuch], [PU: Alphascript Publishing], In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing an… Plus…
[ED: Taschenbuch], [PU: Alphascript Publishing], In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase "DIP package" is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is..., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 100, Banküberweisung, PayPal, Klarna-Sofortüberweisung, [CT: Sonstiges / Sonstiges]<
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Dual in-line package
- nouveau livreISBN: 9786130233723
In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins… Plus…
In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase "DIP package" is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. Bücher / Naturwissenschaften, Medizin, Informatik & Technik / Technik<
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Dual in-line package
- edition reliée, livre de poche2009, ISBN: 9786130233723
[ED: Kartoniert / Broschiert], [PU: Alphascript Publishing], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. In microelectronics, a dual i… Plus…
[ED: Kartoniert / Broschiert], [PU: Alphascript Publishing], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of, DE, [SC: 0.00], Neuware, gewerbliches Angebot, Hardcover, 100, [GW: 165g], 1/2009, Banküberweisung, PayPal<
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