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High Performance Thermal-aware Distributed Computing - Pyla, Hari K.
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Pyla, Hari K.:
High Performance Thermal-aware Distributed Computing - Livres de poche

2008, ISBN: 3836435594, Lieferbar binnen 4-6 Wochen Frais d'envoiVersandkostenfrei innerhalb der BRD

ID: 9783836435598

Internationaler Buchtitel. In englischer Sprache. Verlag: VDM Verlag, Paperback, 76 Seiten, L=240mm, B=170mm, H=5mm, Gew.=160gr, [GR: 16320 - HC/Informatik], Kartoniert/Broschiert, Klappentext: The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting. The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting.

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High Performance Thermal-aware Distributed Computing - Pyla, Hari K.
Livre non disponible
(*)
Pyla, Hari K.:
High Performance Thermal-aware Distributed Computing - Livres de poche

2008, ISBN: 3836435594, Lieferbar binnen 4-6 Wochen

ID: 9783836435598

Internationaler Buchtitel. In englischer Sprache. Verlag: VDM Verlag, Paperback, 76 Seiten, L=240mm, B=170mm, H=5mm, Gew.=160gr, [GR: 16320 - HC/Informatik], Kartoniert/Broschiert, Klappentext: The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting.

Nouveaux livres eurobuch.neubuch
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(*) Livre non disponible signifie que le livre est actuellement pas disponible à l'une des plates-formes associées nous recherche.
High Performance Thermal-aware Distributed Computing - Pyla, Hari K.
Livre non disponible
(*)
Pyla, Hari K.:
High Performance Thermal-aware Distributed Computing - Livres de poche

2008, ISBN: 3836435594, Lieferbar binnen 4-6 Wochen

ID: 9783836435598

Internationaler Buchtitel. In englischer Sprache. Verlag: VDM Verlag, Paperback, 76 Seiten, L=240mm, B=170mm, H=5mm, Gew.=160gr, [GR: 16320 - HC/Informatik], Kartoniert/Broschiert, Klappentext: The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting.

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High Performance Thermal-aware Distributed Computing. - Hari K. Pyla
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Hari K. Pyla:
High Performance Thermal-aware Distributed Computing. - livre d'occasion

2008, ISBN: 9783836435598

ID: a09129783836435598

Erscheinungsjahr: 2008., Verlag/Ort: VDM VERLAG DR. MÜLLER, 2008. 76 S. 22 cm Zustand: Neubuch. Artikel ist NEU! ISBN: 9783836435598. [The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques, Where do I start optimizing my parallel application to reduce thermals, Are the thermal properties of my application similar across machines in a cluster, What and where are the performance effects of thermal optimizations on my application, How do I regulate thermals within the threshold limits and yet maintain performance Readers with a background in the computer science, electrical and electronics engineering find this book interesting.[ -- Kategorie: Informatik]

livre d'occasion Antbo.de
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Détails sur le livre
High Performance Thermal-aware Distributed Computing

The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting.

Informations détaillées sur le livre - High Performance Thermal-aware Distributed Computing


EAN (ISBN-13): 9783836435598
ISBN (ISBN-10): 3836435594
Livre de poche
Date de parution: 2008
Editeur: VDM Verlag
76 Pages
Poids: 0,160 kg
Langue: eng/Englisch

Livre dans la base de données depuis 03.06.2008 08:41:45
Livre trouvé récemment le 02.03.2011 09:12:38
ISBN/EAN: 9783836435598

ISBN - Autres types d'écriture:
3-8364-3559-4, 978-3-8364-3559-8


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