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Handbook of Wafer Bonding - Peter Ramm
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Peter Ramm:
Handbook of Wafer Bonding - nouveau livre

ISBN: 9783527326464

[ED: Buch], [PU: Wiley VCH Verlag GmbH], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding Direct Wafer Bonding Metal Bonding and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries., [SC: 0.00], Neuware, gewerbliches Angebot, 530x170x10 mm, [GW: 937g]

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buchZ AG
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(*) Livre non disponible signifie que le livre est actuellement pas disponible à l'une des plates-formes associées nous recherche.
Handbook of Wafer Bonding - Peter Ramm
Livre non disponible
(*)
Peter Ramm:
Handbook of Wafer Bonding - nouveau livre

ISBN: 9783527326464

[ED: Buch], [PU: Wiley VCH Verlag GmbH], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding Direct Wafer Bonding Metal Bonding and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries., [SC: 0.00], Neuware, gewerbliches Angebot, 530x170x10 mm, [GW: 937g]

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Carl Hübscher GmbH
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(*) Livre non disponible signifie que le livre est actuellement pas disponible à l'une des plates-formes associées nous recherche.
Handbook of Wafer Bonding - Peter Ramm
Livre non disponible
(*)
Peter Ramm:
Handbook of Wafer Bonding - nouveau livre

ISBN: 9783527326464

[ED: Buch], [PU: Wiley VCH Verlag GmbH], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding Direct Wafer Bonding Metal Bonding and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries., [SC: 0.00], Neuware, gewerbliches Angebot, FixedPrice, [GW: 937g]

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Handbook of Wafer Bonding - Ramm, Peter; Lu, James Jian-Qiang; Taklo, Maaike M. V.
Livre non disponible
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Ramm, Peter; Lu, James Jian-Qiang; Taklo, Maaike M. V.:
Handbook of Wafer Bonding - nouveau livre

ISBN: 9783527326464

ID: 822735

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries. Technology Technology eBook, Wiley

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Handbook of Wafer Bonding - Ramm, Peter (Herausgeber); Lu, James Jian-Qiang (Herausgeber); Taklo, Maaike M. V. (Herausgeber)
Livre non disponible
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Ramm, Peter (Herausgeber); Lu, James Jian-Qiang (Herausgeber); Taklo, Maaike M. V. (Herausgeber):
Handbook of Wafer Bonding - edition reliée, livre de poche

2012, ISBN: 3527326464

ID: A14771001

Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, mit Schutzumschlag neu, [PU:Wiley VCH Verlag GmbH]

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Détails sur le livre
Handbook of Wafer Bonding
Auteur:

Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo

Titre:

Handbook of Wafer Bonding

ISBN:

Informations détaillées sur le livre - Handbook of Wafer Bonding


EAN (ISBN-13): 9783527326464
ISBN (ISBN-10): 3527326464
Version reliée
Date de parution: 2012
Editeur: Wiley VCH Verlag GmbH
395 Pages
Poids: 0,937 kg
Langue: Englisch

Livre dans la base de données depuis 14.09.2008 15:42:19
Livre trouvé récemment le 19.02.2017 14:21:28
ISBN/EAN: 9783527326464

ISBN - Autres types d'écriture:
3-527-32646-4, 978-3-527-32646-4


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