ISBN: 9781441909831
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Plus…
| Indigo.ca new in stock. Frais d'envoizzgl. Versandkosten., Livraison non-comprise Details... |
2009, ISBN: 9781441909831
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Hardcover, Auflage: 2010, 301 Seiten, Publiziert: 2009-11-17T00:00:01Z, Produktgruppe: Book, 1.33 kg, Books Gl… Plus…
| amazon.co.uk swestbooks Gebraucht, wie neu. Frais d'envoiIn stock. Real shipping costs can differ from the ones shown here. (EUR 5.59) Details... |
ISBN: 9781441909831
Hardback, [PU: Springer-Verlag New York Inc.], RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to … Plus…
| BookDepository.com Frais d'envoiVersandkostenfrei. (EUR 0.00) Details... |
![RF and Microwave Microelectronics Packaging - Kuang, Ken [Editor]; Kim, Franklin [Editor]; Cahill, Sean S. [Editor];](https://images.eurolivre.fr/buch/cover/OTc4MTQ0MTkwOTgzMTtodHRwczovL2ltYWdlcy5ldXJvbGl2cmUuZnIvaW1hZ2VzL2ZyL3BhcnRzL2NvdmVyX3ZlcmdyaWZmZW4ucG5n.png)
ISBN: 9781441909831
Springer. hardcover. New. 6x0x9. Brand New Book in Publishers original Sealing, Springer, 6
| Biblio.co.uk |
2009, ISBN: 1441909834
[EAN: 9781441909831], New book, [PU: Springer], Clean and crisp and new!, Books
| AbeBooks.com Welcome Back Books, Toledo, OH, U.S.A. [64434632] [Rating: 5 (of 5)] NEW BOOK. Frais d'envoiFree shipping. (EUR 0.00) Details... |
RF and Microwave Microelectronics Packaging by Ken Kuang Hardcover | Indigo Chapters - nouveau livre
ISBN: 9781441909831
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Plus…
2009, ISBN: 9781441909831
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Hardcover, Auflage: 2010, 301 Seiten, Publiziert: 2009-11-17T00:00:01Z, Produktgruppe: Book, 1.33 kg, Books Gl… Plus…
ISBN: 9781441909831
Hardback, [PU: Springer-Verlag New York Inc.], RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to … Plus…
ISBN: 9781441909831
Springer. hardcover. New. 6x0x9. Brand New Book in Publishers original Sealing, Springer, 6
2009, ISBN: 1441909834
[EAN: 9781441909831], New book, [PU: Springer], Clean and crisp and new!, Books
Données bibliographiques du meilleur livre correspondant
| Auteur: | |
| Titre: | |
| ISBN: |
Informations détaillées sur le CD - RF and Microwave Microelectronics Packaging
EAN (ISBN-13): 9781441909831
ISBN (ISBN-10): 1441909834
Version reliée
Date de parution: 2009
Editeur: Springer
285 Pages
Poids: 0,635 kg
Langue: eng/Englisch
CD dans la base de données depuis2007-08-09T02:08:01+02:00 (Paris)
Page de détail modifiée en dernier sur 2023-07-29T15:36:34+02:00 (Paris)
EAN: 9781441909831
EAN - Autres types d'écriture:
1-4419-0983-4, 978-1-4419-0983-1
Autres types d'écriture et termes associés:
Auteur du CD: cahill, franklin, kim, kuang
Titre du CD: self packaging, microwave for one, microelectronics
Données de l'éditeur
Auteur: Ken Kuang; Franklin Kim; Sean S. Cahill
Titre: RF and Microwave Microelectronics Packaging
Editeur: Springer; Springer US
285 Pages
Date de parution: 2009-11-17
New York; NY; US
Imprimé / Fabriqué en
Langue: Anglais
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
POD
XVI, 285 p.
BB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; 3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; high-frequency electronics; material; packaging and processing methods; simulation; thermal management; thermal mechanical designs; Electronics and Microelectronics, Instrumentation; Microwaves, RF Engineering and Optical Communications; Electronic Circuits and Systems; Schaltkreise und Komponenten (Bauteile); EA; BC
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras
Autres livres qui pourraient ressembler au livre recherché:
Dernier livre similaire:
9783319516974 RF and Microwave Microelectronics Packaging II (Ken Kuang; Rick Sturdivant)
- 9783319516974 RF and Microwave Microelectronics Packaging II (Ken Kuang; Rick Sturdivant)
- 9781489983244 RF and Microwave Microelectronics Packaging by Ken Kuang Paperback | Indigo Chapters (Ken Kuang)
- 9781441909855 RF and Microwave Microelectronics Packaging
- 9781441909848 RF and Microwave Microelectronics Packaging (Serguei Cheloukhine)
- RF and Microwave Microelectronics Packaging (Ken Kuang, Franklin Kim & Sean S. Cahill)
< pour archiver...