Micro And Opto-Electronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, 2 Volumes Set - nouveau livre
ISBN: 9780387279749
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MICRO- AND OPTO-ELECTRONIC MATERIALS AND STRUCTURES: PHYSICS, MECHANICS, DESIGN, RELIABILITY, PACKAGING (2 VOLUME SET) - edition reliée, livre de poche
2007, ISBN: 9780387279749
Springer, 2007. 1st. Hardcover. New/New., Springer, 2007, 6
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Micro and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, 2 Volumes Set - edition reliée, livre de poche
2006, ISBN: 9780387279749
Hard cover, New, US edition. Satisfaction guaranteed! !, [PU: Springer]
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2007, ISBN: 0387279741
[EAN: 9780387279749], New book, [SC: 7.22], [PU: Springer], pp. lxii + 1460, Books
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2007, ISBN: 9780387279749
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Biblio.co.uk |
Micro And Opto-Electronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, 2 Volumes Set - nouveau livre
ISBN: 9780387279749
New/New. Brand New Original US Edition, Perfect Condition. Printed in English. Excellent Quality, Service and customer satisfaction guaranteed!, 6
SUHIR, EPHRAIM; LEE, Y.C.; WONG, C.P,:
MICRO- AND OPTO-ELECTRONIC MATERIALS AND STRUCTURES: PHYSICS, MECHANICS, DESIGN, RELIABILITY, PACKAGING (2 VOLUME SET) - edition reliée, livre de poche2007, ISBN: 9780387279749
Springer, 2007. 1st. Hardcover. New/New., Springer, 2007, 6
Micro and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, 2 Volumes Set - edition reliée, livre de poche
2006
ISBN: 9780387279749
Hard cover, New, US edition. Satisfaction guaranteed! !, [PU: Springer]
2007, ISBN: 0387279741
[EAN: 9780387279749], New book, [SC: 7.22], [PU: Springer], pp. lxii + 1460, Books
2007, ISBN: 9780387279749
Like New., 5
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Informations détaillées sur le livre - Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging
EAN (ISBN-13): 9780387279749
ISBN (ISBN-10): 0387279741
Version reliée
Livre de poche
Date de parution: 2007
Editeur: Springer
1460 Pages
Poids: 3,448 kg
Langue: eng/Englisch
Livre dans la base de données depuis 2008-01-22T14:54:32+01:00 (Paris)
Page de détail modifiée en dernier sur 2023-11-19T17:18:52+01:00 (Paris)
ISBN/EAN: 9780387279749
ISBN - Autres types d'écriture:
0-387-27974-1, 978-0-387-27974-9
Autres types d'écriture et termes associés:
Auteur du livre: wong lee, kamphaus, bromet
Titre du livre: electronic structure materials, micro opto electronic materials structures physics mechanics design reliability packaging volume materials physics materials mechan, materials and structures, suhi
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