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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging - Ephraim Suhir, Y.C. Lee, C.P. Wong
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Ephraim Suhir, Y.C. Lee, C.P. Wong:
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging - edition reliée, livre de poche

ISBN: 0387279741

[SR: 8009936], Hardcover, [EAN: 9780387279749], Springer, Springer, Book, [PU: Springer], Springer, This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product. , 13718, Microelectronics, 13707, Electronics, 227544, Electrical & Electronics, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 7921653011, Products, 13762, Industrial Design, 227550, Industrial, Manufacturing & Operational Systems, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 713557011, Materials Science, 226704, Materials & Material Science, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 13778, Mechanical, 13781, Drafting & Mechanical Drawing, 3074641, Fluid Dynamics, 13785, Fracture Mechanics, 13790, Hydraulics, 13792, Machinery, 13687, Robotics & Automation, 52213011, Tribology, 16244091, Welding, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 13570, Chemistry, 16052551, Alkaloids, 13571, Analytic, 13511, Biochemistry, 16052341, Chemical Physics, 16052451, Chromatography, 13575, Clinical, 13577, Crystallography, 13922614011, Electrochemistry, 13579, General & Reference, 226694, Geochemistry, 13590, Industrial & Technical, 13581, Inorganic, 16052621, Molecular Chemistry, 16052651, Nuclear Chemistry, 13585, Organic, 16052661, Photochemistry, 13588, Physical & Theoretical, 16052541, Polymers & Macromolecules, 16052401, Safety, 75, Science & Math, 1000, Subjects, 283155, Books, 226697, Electromagnetism, 16052201, Electricity, 16052241, Magnetism, 14545, Physics, 75, Science & Math, 1000, Subjects, 283155, Books, 14589, Optics, 14545, Physics, 75, Science & Math, 1000, Subjects, 283155, Books, 14585, Solid-State Physics, 13731, Superconductivity, 14545, Physics, 75, Science & Math, 1000, Subjects, 283155, Books, 491346, Industrial Engineering, 468212, Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books, 491348, Mechanical Engineering, 468212, Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books, 491732, Physics, 468216, Science & Mathematics, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging - Ephraim Suhir, Y.C. Lee, C.P. Wong
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Ephraim Suhir, Y.C. Lee, C.P. Wong:
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging - edition reliée, livre de poche

ISBN: 0387279741

[SR: 8009936], Hardcover, [EAN: 9780387279749], Springer, Springer, Book, [PU: Springer], Springer, This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product. , 13718, Microelectronics, 13707, Electronics, 227544, Electrical & Electronics, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 7921653011, Products, 13762, Industrial Design, 227550, Industrial, Manufacturing & Operational Systems, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 713557011, Materials Science, 226704, Materials & Material Science, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 13778, Mechanical, 13781, Drafting & Mechanical Drawing, 3074641, Fluid Dynamics, 13785, Fracture Mechanics, 13790, Hydraulics, 13792, Machinery, 13687, Robotics & Automation, 52213011, Tribology, 16244091, Welding, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 13570, Chemistry, 16052551, Alkaloids, 13571, Analytic, 13511, Biochemistry, 16052341, Chemical Physics, 16052451, Chromatography, 13575, Clinical, 13577, Crystallography, 13922614011, Electrochemistry, 13579, General & Reference, 226694, Geochemistry, 13590, Industrial & Technical, 13581, Inorganic, 16052621, Molecular Chemistry, 16052651, Nuclear Chemistry, 13585, Organic, 16052661, Photochemistry, 13588, Physical & Theoretical, 16052541, Polymers & Macromolecules, 16052401, Safety, 75, Science & Math, 1000, Subjects, 283155, Books, 226697, Electromagnetism, 16052201, Electricity, 16052241, Magnetism, 14545, Physics, 75, Science & Math, 1000, Subjects, 283155, Books, 14589, Optics, 14545, Physics, 75, Science & Math, 1000, Subjects, 283155, Books, 14585, Solid-State Physics, 13731, Superconductivity, 14545, Physics, 75, Science & Math, 1000, Subjects, 283155, Books, 491346, Industrial Engineering, 468212, Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books, 491348, Mechanical Engineering, 468212, Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books, 491732, Physics, 468216, Science & Mathematics, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - Ephraim Suhir#Y. C. Lee#C. P. Wong
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - nouveau livre

2007, ISBN: 9780387279749

ID: 41993394

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions. Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book. The first comprehensive reference containing practical and easy-to-use information on micro- and opto-electronic materials. It details their assemblies, structures and systems, and gives practical recommendations on how to apply current knowledge in this field. Bücher > Fremdsprachige Bücher > Englische Bücher gebundene Ausgabe 29.05.2007 Buch (fremdspr.), Springer, .200

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - Ephraim Suhir#Y. C. Lee#C. P. Wong
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Ephraim Suhir#Y. C. Lee#C. P. Wong:
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - nouveau livre

ISBN: 9780387279749

ID: 739405649

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions. Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book. The first comprehensive reference containing practical and easy-to-use information on micro- and opto-electronic materials. It details their assemblies, structures and systems, and gives practical recommendations on how to apply current knowledge in this field. Buch (fremdspr.) Bücher>Fremdsprachige Bücher>Englische Bücher, Springer

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Micro- and Opto-electronic Materials and Structures - Ephraim Suhir; Y. C. Lee; C. P. Wong
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Micro- and Opto-electronic Materials and Structures - edition reliée, livre de poche

2007, ISBN: 9780387279749

ID: 7179732

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Détails sur le livre
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Informations détaillées sur le livre - Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan


EAN (ISBN-13): 9780387279749
ISBN (ISBN-10): 0387279741
Version reliée
Date de parution: 2007
Editeur: Springer-Verlag GmbH
1460 Pages
Poids: 3,448 kg
Langue: eng/Englisch

Livre dans la base de données depuis 22.01.2008 14:54:32
Livre trouvé récemment le 15.08.2017 15:50:08
ISBN/EAN: 9780387279749

ISBN - Autres types d'écriture:
0-387-27974-1, 978-0-387-27974-9


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