2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Plus…
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2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Plus…
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2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Plus…
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2012, ISBN: 3527326464
Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… Plus…
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ISBN: 9783527326464
hardback, [PU: Wiley-VCH, Weinheim]
Blackwells.co.uk |
2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Plus…
2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Plus…
2006
ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Plus…
2012, ISBN: 3527326464
Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… Plus…
ISBN: 9783527326464
hardback, [PU: Wiley-VCH, Weinheim]
Données bibliographiques du meilleur livre correspondant
Auteur: | |
Titre: | |
ISBN: |
Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Informations détaillées sur le livre - Handbook of Wafer Bonding
EAN (ISBN-13): 9783527326464
ISBN (ISBN-10): 3527326464
Version reliée
Date de parution: 2012
Editeur: Wiley-VCH
395 Pages
Poids: 0,937 kg
Langue: Englisch
Livre dans la base de données depuis 2008-09-14T15:42:19+02:00 (Paris)
Page de détail modifiée en dernier sur 2024-01-24T20:43:42+01:00 (Paris)
ISBN/EAN: 3527326464
ISBN - Autres types d'écriture:
3-527-32646-4, 978-3-527-32646-4
Autres types d'écriture et termes associés:
Auteur du livre: ramm, peter james, peter troy, jia, jian, wiley vch verlag gmbh
Titre du livre: bon, bonding, bond, handbook
Données de l'éditeur
Auteur: Peter Ramm; James Jian-Qiang Lu; Maaike M. V. Taklo
Titre: Handbook of Wafer Bonding
Editeur: Wiley-VCH; Wiley-VCH
396 Pages
Date de parution: 2012-01-11
Imprimé / Fabriqué en
Poids: 0,924 kg
Langue: Anglais
185,00 € (DE)
190,20 € (AT)
Available
170mm x 240mm x 26mm
BB; Hardcover, Softcover / Chemie/Sonstiges; Nanowissenschaften; Verstehen; Chemie; Components & Devices; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Halbleiterphysik; Komponenten u. Bauelemente; MEMS; Mikrosystemtechnik; Nanomaterial; Nanomaterialien; Nanomaterials; Nanostrukturiertes Material; Nanotechnologie; Nanotechnology; Physics; Physik; Semiconductor Physics; Wafer; MEMS; Komponenten u. Bauelemente; Nanomaterialien; Halbleiterphysik; Nanotechnologie
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.Autres livres qui pourraient ressembler au livre recherché:
Dernier livre similaire:
9783527644230 Handbook of Wafer Bonding (Wiley-VCH)
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