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Electromigration in ULSI Interconnections (International Series on Advances in Solid State Electronics and Technology) - Cher Ming Tan
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Cher Ming Tan:

Electromigration in ULSI Interconnections (International Series on Advances in Solid State Electronics and Technology) - edition reliée, livre de poche

ISBN: 9814273325

[SR: 1551060], Hardcover, [EAN: 9789814273329], World Scientific Publishing Company, World Scientific Publishing Company, Book, [PU: World Scientific Publishing Company], World Scientific Publishing Company, Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed., 227544, Electrical & Electronics, 3747, Networks, 173515, Engineering, 173507, Professional & Technical, 1000, Subjects, 283155, Books, 21, Education & Reference, 11444, Almanacs & Yearbooks, 11448, Atlases & Maps, 2572, Careers, 11626, Catalogs & Directories, 69820, College & University, 11472, Consumer Guides, 11475, Dictionaries & Thesauruses, 11713, Encyclopedias, 11823, English as a Second Language, 11761, Etiquette, 11773, Foreign Language Study & Reference, 11880, Genealogy, 5267709011, Graduate School, 11902, Quotations, 5267708011, Schools & Teaching, 5267723011, Studying & Workbooks, 5267710011, Test Preparation, 11871, Trivia & Fun Facts, 11970, Words, Language & Grammar, 5267707011, Writing, Research & Publishing Guides, 1000, Subjects, 283155, Books, 468212, Engineering, 491336, Aeronautical Engineering, 491338, Chemical Engineering, 491340, Civil Engineering, 491342, Electrical & Electronic Engineering, 684258011, Environmental Engineering, 491346, Industrial Engineering, 491348, Mechanical Engineering, 684259011, Nuclear Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books

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Electromigration in Ulsi Interconnections - Tan, Cher Ming; Roy, Arijit
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Tan, Cher Ming; Roy, Arijit:

Electromigration in Ulsi Interconnections - nouveau livre

ISBN: 9789814273329

ID: 731200

"Electromigration in ULSI Interconnections" provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electro migration are presented in a concise and rigorous manner.Methods of numerical modeling for the interconnect electro migration and their applications to the understanding of electro migration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electro migration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electro migration are outlined and discussed. Technology Technology eBook, World Scientific Publishing Company

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Electromigration in Ulsi Interconnections - Cher Ming Tan
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Cher Ming Tan:
Electromigration in Ulsi Interconnections - nouveau livre

ISBN: 9789814273329

Cher Ming Tan,Hardcover, English-language edition,Pub by World Scientific Publishing Company, Incorporated Textbooks New Books ~~ Technology~~ Electronics ~~ Circuits ~~ Integrated Electromigration-in-ULSI-Interconnections~~Cher-Ming-Tan World Scientific Publishing Company, Incorporated

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Electromigration in ULSI Interconnections - Tan, Cher Ming
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Tan, Cher Ming:
Electromigration in ULSI Interconnections - edition reliée, livre de poche

2010, ISBN: 9814273325, Lieferbar binnen 4-6 Wochen Frais d'envoiVersandkostenfrei innerhalb der BRD

ID: 9789814273329

Internationaler Buchtitel. In englischer Sprache. Verlag: WORLD SCIENTIFIC PUB CO (, 291 Seiten, L=233mm, B=160mm, H=25mm, Gew.=570gr, [GR: 16850 - HC/Elektronik/Elektrotechnik/Nachrichtentechnik], [SW: - Technology & Industrial Arts], Gebunden

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Electromigration In Ulsi Interconnections - Cher Ming Tan
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Cher Ming Tan:
Electromigration In Ulsi Interconnections - edition reliée, livre de poche

ISBN: 9789814273329

ID: 9789814273329

Electromigration In Ulsi Interconnections Electromigration-in-ULSI-Interconnections~~Cher-Ming-Tan Science/Tech>Engineering>ELEC Engr Hardcover, World Scientific Publishing Company, Incorporated

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Détails sur le livre
Electromigration in ULSI Interconnections (International Series on Advances in Solid State Electronics and Technology)
Auteur:

Tan, Cher Ming

Titre:

Electromigration in ULSI Interconnections (International Series on Advances in Solid State Electronics and Technology)

ISBN:

9789814273329

Informations détaillées sur le livre - Electromigration in ULSI Interconnections (International Series on Advances in Solid State Electronics and Technology)


EAN (ISBN-13): 9789814273329
ISBN (ISBN-10): 9814273325
Version reliée
Date de parution: 2010
Editeur: WORLD SCIENTIFIC PUB CO (
291 Pages
Poids: 0,570 kg
Langue: eng/Englisch

Livre dans la base de données depuis 13.01.2012 18:40:48
Livre trouvé récemment le 02.09.2016 08:48:51
ISBN/EAN: 9789814273329

ISBN - Autres types d'écriture:
981-4273-32-5, 978-981-4273-32-9

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