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Dual in-line package - Frederic P. Miller
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Frederic P. Miller:

Dual in-line package - Livres de poche

ISBN: 9786130233723

ID: 9786130233723

Pin grid array, DIP switch, Chip carrier, Microelectronics, Through-hole technology, Printed circuit board, Soldering, Integrated circuit, Microprocessor, Rotary encoder, Light-emitting diode In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase `DIP package` is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. Dual in-line package: In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase `DIP package` is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14., Alphascript Publishing

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Dual In-Line Package - Frederic P. Miller, Agnes F. Vandome, John McBrewster
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Frederic P. Miller, Agnes F. Vandome, John McBrewster:

Dual In-Line Package - nouveau livre

ISBN: 9786130233723

ID: 9786130233723

Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase "DIP package" is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. Books, Technology~~Electronics~~General, Dual-In-Line-Package~~Frederic-P-Miller, 999999999, Dual In-Line Package, Frederic P. Miller, Agnes F. Vandome, John McBrewster, 6130233728, International Book Marketing Service Ltd, , , , , International Book Marketing Service Ltd

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Dual in-line package
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Dual in-line package - Livres de poche

ISBN: 6130233728

Edition reliée, ID: 5943337

Pin grid array, DIP switch, Chip carrier, Microelectronics, Through-hole technology, Printed circuit board, Soldering, Integrated circuit, Microprocessor, Rotary encoder, Light-emitting diode - Buch, gebundene Ausgabe, 100 S., Beilagen: Paperback, Erschienen: 2009 Alphascript Publishing In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase 'DIP package' is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.

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Dual in-line package - Frederic P. Miller
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Frederic P. Miller:
Dual in-line package - nouveau livre

ISBN: 9786130233723

ID: 79bc262d1e54db2db74a3ad92e053f71

In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase "DIP package" is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. Bücher / Naturwissenschaften, Medizin, Informatik & Technik / Technik

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Dual in-line package
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Dual in-line package - Livres de poche

2009, ISBN: 6130233728

Edition reliée, ID: 5943337

Pin grid array, DIP switch, Chip carrier, Microelectronics, Through-hole technology, Printed circuit board, Soldering, Integrated circuit, Microprocessor, Rotary encoder, Light-emitting diode - Buch, gebundene Ausgabe, 100 S., Beilagen: Paperback, Erschienen: 2009 Alphascript Publishing

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Détails sur le livre
Dual in-line package
Auteur:

Frederic P. Miller, Agnes F. Vandome, John McBrewster

Titre:

Dual in-line package

ISBN:

9786130233723

In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase 'DIP package' is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.

Informations détaillées sur le livre - Dual in-line package


EAN (ISBN-13): 9786130233723
ISBN (ISBN-10): 6130233728
Version reliée
Livre de poche
Date de parution: 2009
Editeur: International Book Marketing Service Ltd

Livre dans la base de données depuis 10.06.2008 23:48:44
Livre trouvé récemment le 26.10.2016 11:21:21
ISBN/EAN: 9786130233723

ISBN - Autres types d'écriture:
613-0-23372-8, 978-613-0-23372-3

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