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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - Verghese, Nishath K.; Allstot, David J.; Schmerbeck, Timothy J.
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Verghese, Nishath K.; Allstot, David J.; Schmerbeck, Timothy J.:

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - edition reliée, livre de poche

1994, ISBN: 0792395441, Lieferbar binnen 4-6 Wochen Frais d'envoiVersandkostenfrei innerhalb der BRD

ID: 9780792395447

Internationaler Buchtitel. In englischer Sprache. Verlag: Springer-Verlag GmbH, HC runder Rücken kaschiert, 308 Seiten, L=244mm, B=167mm, H=25mm, Gew.=603gr, [GR: 16850 - HC/Elektronik/Elektrotechnik/Nachrichtentechnik], Gebunden, Klappentext: The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality. The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - Verghese, Nishath K. Schmerbeck, Timothy J. Allstot, David J.
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Verghese, Nishath K. Schmerbeck, Timothy J. Allstot, David J.:

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - edition reliée, livre de poche

ISBN: 9780792395447

[ED: Hardcover], [PU: Springer, Berlin], The goal of putting systems on a chip' has been a difficult challenge that is only recently being met. Since the world is analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. br/ emSimulation Techniques and Solutions for Mixed-Signal Coupling in/em emIntegrated Circuits/em addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a build it and see' mentality. br/xxiii, 280 S. 77 SW-Abb., XXIII, 280 p.Versandfertig in 3-5 Tagen, [SC: 0.00]

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - David J. Allstot Timothy J. Schmerbeck Nishath K. Verghese
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David J. Allstot Timothy J. Schmerbeck Nishath K. Verghese:
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - edition reliée, livre de poche

1994

ISBN: 9780792395447

ID: 602933345

Springer , 1994. hardcover. New. pp. 280 1 Ed. 94 The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circu, Springer, 1994

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science) - Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot
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Nishath K. Verghese, Timothy J. Schmerbeck, David J. Allstot:
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science) - edition reliée, livre de poche

1995, ISBN: 9780792395447

ID: 585706130

Springer, 1994-12-31. 1995. Hardcover. New. Buy with confidence. Excellent Customer Service & Return policy. Ships Fast. Expedite Shipping Available., Springer, 1994-12-31

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - Nishath K. Verghese
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Nishath K. Verghese:
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - edition reliée, livre de poche

ISBN: 9780792395447

ID: 9780792395447

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits Simulation-Techniques-and-Solutions-for-Mixed-Signal-Coupling-in-Integrated-Circuits~~Nishath-K-Verghese Science/Tech>Engineering>ELEC Engr Hardcover, Springer US

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Détails sur le livre
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Auteur:

Verghese, Nishath K.; Allstot, David J.; Schmerbeck, Timothy J.

Titre:

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

ISBN:

9780792395447

The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.

Informations détaillées sur le livre - Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits


EAN (ISBN-13): 9780792395447
ISBN (ISBN-10): 0792395441
Version reliée
Date de parution: 1994
Editeur: Springer-Verlag GmbH
308 Pages
Poids: 0,603 kg
Langue: eng/Englisch

Livre dans la base de données depuis 17.03.2008 15:40:48
Livre trouvé récemment le 18.09.2016 22:44:39
ISBN/EAN: 9780792395447

ISBN - Autres types d'écriture:
0-7923-9544-1, 978-0-7923-9544-7

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