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Fundamentals of Semiconductor Processing Technology - edition reliée, livre de poche

1994, ISBN: 9780792395348

Springer, Hardcover, Auflage: 1995, 615 Seiten, Publiziert: 1994-12-31T00:00:01Z, Produktgruppe: Book, 2.3 kg, Verkaufsrang: 6037905, Microprocessors & System Design, Hardware & DIY, Comp… Plus…

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ISBN: 9780792395348

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El-Kareh, Badih; Hutter, Lou N.:
Fundamentals of Semiconductor Processing Technology - edition reliée, livre de poche

1994

ISBN: 0792395344

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Fundamentals of Semiconductor Processing Technology - edition reliée, livre de poche

1994, ISBN: 0792395344

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Fundamentals of Semiconductor Processing Technology - edition reliée, livre de poche

1994, ISBN: 0792395344

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Fundamentals of Semiconductor Processing Technology

The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster and more reliable circuits with lower power consumption. The development of new processing tools and technologies aims at optimizing one or more of these requirements. This goal, however, can only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufacturing. It is thus important that experts in specific disciplines, such as device and circuit design, understand the principle, capabilities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Fundamentals of Semiconductor Processing Technologies is written to bridge different disciplines. It presents to engineers and scientists those parts of modern processing technologies that are of greatest importance to the design and manufacture of semiconductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and circuits, their electrical parameters, reliability, and yield. Fundamentals of Semiconductor Processing Technologies serves as a base on which to build an understanding of the manufacture of semiconductor products. It is written in a form to satisfy the needs of engineers and scientists in semiconductor research, development and manufacturing, and to be conveniently used for a one-semester graduate-level course in semiconductor engineering or materials science curriculum.

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EAN (ISBN-13): 9780792395348
ISBN (ISBN-10): 0792395344
Version reliée
Date de parution: 2007
Editeur: Springer
616 Pages
Poids: 1,081 kg
Langue: eng/Englisch

Livre dans la base de données depuis 2007-10-21T19:41:45+02:00 (Paris)
Page de détail modifiée en dernier sur 2023-07-11T08:15:54+02:00 (Paris)
ISBN/EAN: 9780792395348

ISBN - Autres types d'écriture:
0-7923-9534-4, 978-0-7923-9534-8
Autres types d'écriture et termes associés:
Auteur du livre: hutter, hütter
Titre du livre: semiconductor, fundamentals semiconductors, fundamentals technology


Données de l'éditeur

Auteur: Badih El-Kareh; Lou N. Hutter
Titre: Fundamentals of Semiconductor Processing Technology
Editeur: Springer; Springer US
602 Pages
Date de parution: 1994-12-31
New York; NY; US
Langue: Anglais
235,39 € (DE)
241,99 € (AT)
260,00 CHF (CH)
Available
XIII, 602 p.

BB; Hardcover, Softcover / Physik, Astronomie/Atomphysik, Kernphysik; Elektronische Geräte und Materialien; Verstehen; Wafer; circuit; development; dielectrics; interconnect; manufacturing; material; materials science; semiconductor; thin films; Semiconductors; Electronics and Microelectronics, Instrumentation; Electronic Circuits and Systems; Electrical and Electronic Engineering; Elektronik; Schaltkreise und Komponenten (Bauteile); Elektrotechnik; BC

1 Semiconductor Crystals.- 1.1 Crystals and Crystallographic Orientations.- 1.2 The Silicon Crystal.- 1.3 Wafer Preparation.- 1.4 Compound Semiconductors.- 2 Thermal Oxidation and Nitridation.- 2.1 SiO2 and SiO2-Si Interface.- 2.2 Thermal Oxidation.- 2.3 Silicon Nitride.- 3 Thin Film Deposition.- 3.1 Chemical Vapor Deposition.- 3.2 Chemical-Physical Deposition Processes.- 3.3 Physical-Vapor Deposition.- 4 Lithography.- 4.1 Optical Lithography.- 4.2 Resolution Enhancement Techniques.- 4.3 Electron-Beam Lithography.- 4.4 X-Ray Lithography.- 4.5 Ion-Beam Lithography.- 5 Contamination Control and Etch.- 5.1 Clean Processes.- 5.2 Etching.- 6 Ion Implantation.- 6.1 Principle of Operation.- 6.2 Energy Loss and Range Distribution.- 6.3 Crystal Damage and Dopant Activity.- 7 Diffusion.- 7.1 Point Defects.- 7.2 Fick’s Laws.- 7.3 Non-Constant Diffusivity.- 7.4 Diffusion in Polysilicon.- 7.5 Diffusion in Insulators.- 7.6 Diffusion Sources.- 7.7 Gettering in Silicon.- 8 Contact and Interconnect Technology.- 8.1 Contact Metallurgy.- 8.2 Poly-Metal Dielectrics.- 8.3 Metal Interconnects.- 8.4 Inter-Level Dielectrics.- 8.5 Multi-Level Metals.- 8.6 Reliability Considerations.

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