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Principles of Dielectric Chemical Mechanical Planarization - Jamshid Sorooshian
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Jamshid Sorooshian:

Principles of Dielectric Chemical Mechanical Planarization - nouveau livre

ISBN: 9783639176810

ID: 041e1ecd2438372e1afb8633bdafcf91

TRIBOLOGICAL, THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore's Law, material characterization and process impacts are critical in providing manufacturer's with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process. Bücher / Fremdsprachige Bücher / Englische Bücher 978-3-639-17681-0, VDM

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Principles of Dielectric Chemical Mechanical Planarization - Sorooshian, Jamshid
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Sorooshian, Jamshid:

Principles of Dielectric Chemical Mechanical Planarization - Livres de poche

ISBN: 3639176812

Edition reliée, ID: 5535754

TRIBOLOGICAL, THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES - Buch, gebundene Ausgabe, 372 S., Beilagen: Paperback, Erschienen: 2009 VDM Verlag Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore's Law, material characterization and process impacts are critical in providing manufacturer's with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process.

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Principles of Dielectric Chemical Mechanical Planarization: TRIBOLOGICAL, THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES - Jamshid Sorooshian
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Principles of Dielectric Chemical Mechanical Planarization: TRIBOLOGICAL, THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES - Livres de poche

ISBN: 3639176812

Taschenbuch, [EAN: 9783639176810], VDM Verlag, VDM Verlag, Book, [PU: VDM Verlag], VDM Verlag, 60525011, Elektronik, 60516011, Elektrotechnik, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 56441011, Technologie, 56447011, Erneuerbare Energien, 56448011, Innovationen, 1320311031, Nachschlagewerke, 56444011, Nanotechnologie, 56449011, Philosophie der Technologie, 56445011, Risiken, 56446011, Sicherheit & Gesundheit, 273011011, Soziale Aspekte, 54518011, Technisches Denken & Schreiben, 56451011, Technologie & Gesellschaft, 56211011, Technologiegeschichte, 56442011, Zukunftsforschung, 56047011, Wissenschaft, 54071011, Genres, 52044011, Fremdsprachige Bücher

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Détails sur le livre
Principles of Dielectric Chemical Mechanical Planarization
Auteur:

Sorooshian, Jamshid

Titre:

Principles of Dielectric Chemical Mechanical Planarization

ISBN:

3639176812

Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore's Law, material characterization and process impacts are critical in providing manufacturer's with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process.

Informations détaillées sur le livre - Principles of Dielectric Chemical Mechanical Planarization


EAN (ISBN-13): 9783639176810
ISBN (ISBN-10): 3639176812
Version reliée
Livre de poche
Editeur: VDM Verlag

Livre dans la base de données depuis 19.12.2009 15:15:36
Livre trouvé récemment le 18.09.2016 22:43:15
ISBN/EAN: 3639176812

ISBN - Autres types d'écriture:
3-639-17681-2, 978-3-639-17681-0

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