2002, ISBN: 9781849965774
The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2… Plus…
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2010, ISBN: 9781849965774
Editor: Engelmaier, Werner, Contributor: Kwon, Dong-il, Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2007, 220 Seiten, Publiziert: 2010-10-18T00:00:01Z, Produktgru… Plus…
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2007, ISBN: 9781849965774
*A Guide to Lead-free Solders* - Physical Metallurgy and Reliability. Softcover reprint of hardcover 1st ed. 2007 / Taschenbuch für 133.49 € / Aus dem Bereich: Bücher, Wissenschaft, Techn… Plus…
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2002, ISBN: 9781849965774
The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2… Plus…
2010, ISBN: 9781849965774
Editor: Engelmaier, Werner, Contributor: Kwon, Dong-il, Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2007, 220 Seiten, Publiziert: 2010-10-13T00:00:01Z, Produktgru… Plus…
2010
ISBN: 9781849965774
[ED: Softcover], [PU: Springer / Springer London / Springer, Berlin], The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. E… Plus…
2010, ISBN: 9781849965774
Editor: Engelmaier, Werner, Contributor: Kwon, Dong-il, Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2007, 220 Seiten, Publiziert: 2010-10-18T00:00:01Z, Produktgru… Plus…
2007, ISBN: 9781849965774
*A Guide to Lead-free Solders* - Physical Metallurgy and Reliability. Softcover reprint of hardcover 1st ed. 2007 / Taschenbuch für 133.49 € / Aus dem Bereich: Bücher, Wissenschaft, Techn… Plus…
Données bibliographiques du meilleur livre correspondant
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Informations détaillées sur le livre - A Guide to Lead-free Solders
EAN (ISBN-13): 9781849965774
ISBN (ISBN-10): 1849965773
Version reliée
Livre de poche
Date de parution: 2010
Editeur: Springer London
220 Pages
Poids: 0,339 kg
Langue: eng/Englisch
Livre dans la base de données depuis 2011-05-18T11:37:04+02:00 (Paris)
Page de détail modifiée en dernier sur 2023-12-27T18:40:03+01:00 (Paris)
ISBN/EAN: 1849965773
ISBN - Autres types d'écriture:
1-84996-577-3, 978-1-84996-577-4
Autres types d'écriture et termes associés:
Auteur du livre: john evans, eva engel, werner eva
Titre du livre: physical metallurgy, lead
Données de l'éditeur
Auteur: John W. Evans
Titre: A Guide to Lead-free Solders - Physical Metallurgy and Reliability
Editeur: Springer; Springer London
206 Pages
Date de parution: 2010-10-13
London; GB
Imprimé / Fabriqué en
Langue: Anglais
133,70 € (DE)
137,45 € (AT)
179,85 CHF (CH)
POD
XIV, 206 p. 114 illus.
BC; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; Lead Substitutes; Metall; Solder Alloys; Standard; architecture; cutting; design; electronics; manufacturing; materials; metal; metallurgy; microstructure; production; reliability; quality control, reliability, safety and risk; Electronics and Microelectronics, Instrumentation; Metals and Alloys; Optical Materials; Security Science and Technology; Mechanical Engineering; Machines, Tools, Processes; Materialwissenschaft; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; Sicherheitssysteme und Brandmeldeanlagen; Maschinenbau; Fertigungstechnik und Ingenieurwesen; BB
to Solder Alloys and Their Properties.- Packaging Architecture and Assembly Technology.- Wetting and Joint Formation.- Microstructural Instability in Solders.- Intermetallic Formation and Growth.- Mechanical Properties and Creep Behavior.- Thermomechanical Fatigue.- Product Assurance.Covers all aspects of lead-free solders from physical properties to product assurance The reader will be able to choose new solders more suitable to the climate of legislation and public opinion based on a comparison of their strengths and weaknesses and with the properties of the lead-based solders currently in use The theoretical basis of the book will allow solder producers to make solders with more desirable properties in the future Includes supplementary material: sn.pub/extras
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