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Three Dimensional System Integration: IC Stacking Process and Design - Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
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Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic:

Three Dimensional System Integration: IC Stacking Process and Design - edition reliée, livre de poche

ISBN: 1441909613

[SR: 5477602], Hardcover, [EAN: 9781441909619], Springer, Springer, Book, [PU: Springer], Springer, Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain., 266160, Drafting & Presentation, 173508, Architecture, 1, Arts & Photography, 1000, Subjects, 283155, Books, 3508, Computer Science, 3887, AI & Machine Learning, 760204, Bioinformatics, 132559011, Computer Simulation, 107196011, Cybernetics, 132574011, Human-Computer Interaction, 107197011, Information Theory, 3897, Robotics, 602672, Systems Analysis & Design, 5, Computers & Technology, 1000, Subjects, 283155, Books, 4075, CAD, 3939, Solidworks, 4134, Graphics & Design, 5, Computers & Technology, 1000, Subjects, 283155, Books, 107178011, Design, 13698, Circuits, 227544, Electrical & Electronics, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 1058, Methods & Materials, 1061, Architecture, 13803, Reference, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 468204, Computer Science, 491298, Algorithms, 491300, Artificial Intelligence, 491306, Database Storage & Design, 491308, Graphics & Visualization, 491302, Networking, 491310, Object-Oriented Software Design, 491312, Operating Systems, 491314, Programming Languages, 491316, Software Design & Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books, 468210, Architecture, 468206, Humanities, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books

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Three Dimensional System Integration: IC Stacking Process and Design - Papanikolaou, Antonis / Soudris, Dimitrios / Radojcic, Riko
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ISBN: 9781441909619

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. Three Dimensional System Integration: IC Stacking Process and Design Papanikolaou, Antonis / Soudris, Dimitrios / Radojcic, Riko, Springer

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Antonis Papanikolaou (Editor), Dimitrios Soudris (Editor), Riko Radojcic (Editor):
Three Dimensional System Integration: IC Stacking Process and Design - edition reliée, livre de poche

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ISBN: 9781441909619

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Three Dimensional System Integration - edition reliée, livre de poche

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Détails sur le livre
Three Dimensional System Integration: IC Stacking Process and Design
Auteur:

Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic

Titre:

Three Dimensional System Integration: IC Stacking Process and Design

ISBN:

1441909613

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Informations détaillées sur le livre - Three Dimensional System Integration: IC Stacking Process and Design


EAN (ISBN-13): 9781441909619
ISBN (ISBN-10): 1441909613
Version reliée
Livre de poche
Date de parution: 2010
Editeur: Springer-Verlag GmbH
246 Pages
Poids: 0,527 kg
Langue: eng/Englisch

Livre dans la base de données depuis 22.04.2008 15:15:08
Livre trouvé récemment le 23.11.2016 20:52:42
ISBN/EAN: 1441909613

ISBN - Autres types d'écriture:
1-4419-0961-3, 978-1-4419-0961-9

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